collect compare
BU14OZ-178-HT
Part number:
BU14OZ-178-HT
describe:
CONN IC DIP SOCKET 14POS GOLD
package:
ROHS status:
Yes
currency:
USD
PDF:
RFQ Add to RFQ list
inventory 1600
Please send an inquiry form, we will reply immediately
Quick inquiry
specifications
  • Mounting Type
    Surface Mount
  • Termination
    Solder
  • Contact Finish - Mating
    Gold
  • Operating Temperature
    -55°C ~ 125°C
  • Contact Finish Thickness - Mating
    78.7µin (2.00µm)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish Thickness - Post
    Flash
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    14 (2 x 7)
  • Contact Material - Mating
    Beryllium Copper
  • Features
    Open Frame
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Material - Post
    Brass
  • Housing Material
    Polybutylene Terephthalate (PBT), Glass Filled
  • Contact Finish - Post
    Copper