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specifications
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Mounting Type
Surface Mount
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Termination
Solder
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Contact Finish - Mating
Gold
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Contact Finish Thickness - Mating
1.00µin (0.025µm)
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Contact Finish - Post
Gold
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Pitch - Mating
0.050" (1.27mm)
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Contact Finish Thickness - Post
1.00µin (0.025µm)
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Housing Material
Liquid Crystal Polymer (LCP)
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Number of Positions or Pins (Grid)
8 (2 x 4)
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Contact Material - Mating
Phosphor Bronze
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Contact Material - Post
Phosphor Bronze
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Pitch - Post
0.050" (1.27mm)
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Features
Board Guide, Closed Frame
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Type
SOIC